Background: Domestic HBM is widely viewed as the binding constraint on China's AI compute. As of mid-2026, teardowns of shipping Chinese accelerators (e.g. Ascend 910C) have found only foreign-made HBM (Samsung/SK Hynix). Huawei's Ascend 950 claims "in-house" HBM but has not disclosed who manufactures the DRAM dies.

Resolves YES if — by Dec 31, 2027, TechInsights or a comparable neutral teardown/analysis firm publishes (directly, or via a credible outlet such as Bloomberg/Reuters/SCMP/Nikkei) a finding that a commercially shipping AI accelerator from a Chinese company contains HBM whose DRAM dies are manufactured by a mainland-Chinese company (CXMT the realistic candidate).

Resolves NO if — teardowns through the deadline continue to attribute the HBM dies to foreign makers (Samsung, SK Hynix, Micron), or no qualifying teardown finding exists.

Tiebreaks: (1) The bar is the origin of the DRAM dies, not packaging — Chinese advanced packaging/stacking of foreign-made dies does NOT count, since the bottleneck is die manufacturing. A teardown distinguishes these. (2) Any HBM generation counts (HBM2E/3/3E) — capability, not tier, is the question. (3) "Huawei in-house HBM" qualifies only if the dies themselves are attributed to a Chinese manufacturer. (4) Engineering samples don't count; the product must be commercially shipping.